Company Profile | GigaDevice Semiconductor Inc.
Haidian, Beijing, N/A, China
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Total FCC IDs
4
Most Recent YoY%
100%
Grantee Codes
2A3BS
Popular Device Types & Grants
Equipment Description | Number of Devices |
|---|---|
| 2.4 GHz Wi-Fi 6 (802.11 ax) and Bluetooth5 (LE) module | 2 |
| 2.4 GHz Wi-Fi 6 (802.11 ax) and Bluetooth 5 (LE) module | 1 |
| 802.11bgn wlan module | 1 |
TCB Grant Type | Number of Devices |
|---|---|
| A4: UNII devices & low power transmitters using spread spectrum techniques | 3 |
| A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices | 1 |
GigaDevice Semiconductor Inc. FCC ID Submissions
GigaDevice Semiconductor Inc. has submitted a total of 4 FCC IDs for their products. Not all of GigaDevice Semiconductor Inc.’s devices have an FCC ID. FCC ID’s are more likely to be submitted for custom designed products with built-in radio modules. Click on any of GigaDevice Semiconductor Inc.’s products below to access more detailed FCC ID information.
FCC ID | Product Name | Product Description | Application Date | Application Type |
|---|---|---|---|---|
2A3BS-GDVW553UNIFI | 2.4 GHz Wi-Fi 6 (802.11 ax) and Bluetooth5 (LE) module | May 26, 2025 | Original Equipment | |
2A3BS-GDVW553MINI-I | 2.4 GHz Wi-Fi 6 (802.11 ax) and Bluetooth5 (LE) module | Apr 7, 2025 | Original Equipment | |
2A3BS-GD32VW553MD1 | 2.4 GHz Wi-Fi 6 (802.11 ax) and Bluetooth 5 (LE) module | Aug 7, 2023 | Original Equipment | |
2A3BS-GD32W515MD1 | 802.11bgn wlan module | Oct 26, 2021 | Original Equipment |
